Assembly Pre-Production and Volume Production

Ayrshire Electronics specializes in high-mix, low- to medium-volume build of electronic and electromechanical assemblies - from prototype circuit boards through box build assemblies. Our Customers are able to take advantage of our diverse capabilities, experience, and careful attention to detail during manufacturing startup through product end-of-life. Today, from all our locations, we support high and low-mix PCB for volumes that range from just a few units for prototypes, to modest quantities for pre-production, to hundreds of thousands in volume production.

Our capabilities accommodate a wide range of lot sizes, delivery schedules and technical requirements. Maximum flexibility is achieved through sophisticated, company-wide intranet scheduling and systems that position customer requirements as the focal point for all business operations. Our assembly services are complemented by front-end product development capabilities including strong CAD layout and design experience. And of course, quality is always first - we employ DFx fundamentals as well as quality and data-tracking methodologies.

Guided by engineers and experienced program managers, our Customer Focused Teams become in-house experts in manufacturing and testing our customer's products. Team members are trained and certified for the skills required. Utilizing continuous process improvement our responsive organizational structure focuses resources in areas that provide the most value to save both time and costs.

Ayrshire Electronics plants consist of over 300,000 square feet of integrated production and office floor space organized for efficient execution, with corporate headquarters located in Louisville Ky. is approximately 80,000 square feet in size. Between the plants, Ayrshire Electronics is able to offer its Customers a complete manufacturing package including SMT and Thru-hole assembly, product test, box build assembly, integration, and order fulfillment.

Surface Mount Technology
- Fine pitch, QFP
- BGA, µBGA, DFN, QFN
- 0201 chips up to 55mm
- Automated Optical Inspection
- Real Time X-Ray
- Solder paste inspection
- Automated rework station

Lead-through Auto Insertion
- Axial
- Axial sequencing
- Radial
- Terminal Zierick/Harwin
- 0.045 Pin Inserters

Rapid Response Center
- Quick turn-prototyping

Environmental Stress
- Large capacity walk-in temperature chambers
- Thermal shock chambers
Conformal Coat – Potting
- Silicone
- Acrylic
Test - Inspection
- Calibration
- ICT
- Functional ATE
- JTAG
- AOI
- MDA’s
 
Home Contact Us About Ayrshire Electronics Services Market Overview Locations